via-in-pad issue (standard technology)
Views : 1512
Author : meidear
Update time : 2020-03-10 16:51:49
DFM/DFA/DFT Tips&Tricks - TIP #03 => via-in-pad issue (standard technology)
Whenever possible, always use enough clearance for the solder mask between the via and the copper pad to prevent solder flow into the via hole and can cause the solderability issues during the assembly and manufacturing process.
This note applies only to standard technology, especially typical 2-layer PCBs.
Please remember, that for multilayer HDI PCBs there is a similar via-in-pad technique (mostly used for small pitch BGAs), but that vias are additionally filled and plated.
There are some exceptions, such as RF circuits, high-current designs or BGA layouts, where that recommendation can be omitted.
Whenever possible, always use enough clearance for the solder mask between the via and the copper pad to prevent solder flow into the via hole and can cause the solderability issues during the assembly and manufacturing process.
This note applies only to standard technology, especially typical 2-layer PCBs.
Please remember, that for multilayer HDI PCBs there is a similar via-in-pad technique (mostly used for small pitch BGAs), but that vias are additionally filled and plated.
There are some exceptions, such as RF circuits, high-current designs or BGA layouts, where that recommendation can be omitted.
Related News
Comparison of LDI and CCD Exposure Systems
Apr .03.2025
In the PCB (Printed Circuit Board) manufacturing process, exposure is a critical step. Many PCB manufacturers like meidearpcb utilize CCD semi-automatic exposure machines for this process.
LED lighting PCB (Printed Circuit Board) Solutions
Jan .01.2025
LED lighting PCB (Printed Circuit Board) solutions
CEM-3 Thermal conductive material
IMS pcb Flexible pcb Copper-base pcbs
CEM-3 Thermal conductive material
IMS pcb Flexible pcb Copper-base pcbs
How many types of surface treatment processes for PCB?
Dec .20.2024
PCB surface treatment processes
HASL,OSP ENIG,Immersion Silver,Immersion Tin hard Gold
nickel P-alladium gold
HASL,OSP ENIG,Immersion Silver,Immersion Tin hard Gold
nickel P-alladium gold
The material difference between high-frequency PCB and high-speed PCB
Sep .03.2024
Professional production, high-frequency, high-speed, HDI, LED lighting board, (Flex, Rigid-Flex,) (Wangling, Taiyao, Nanya, Isola, Rogers, Pana-sonic,) Quotation email: mkt@me-pcb.com
